Thermal enhancements of a led based automotive

Abstract

Light Emitting Diode (LED) is a new kind of light source that is quickly being used into automotive lighting systems. In recent years, there have been increased expectations placed on vehicle headlamps, including that they not only be fully functional, affordable, and longlasting, but also stylish, energy-efficient, and environmentally friendly.

Since

LED light sources are long-lasting, highly efficient, and energyefficient,

small in size, etc., they are frequently utilized in headlamps, turn signals, brake lights, position lights, etc. and will soon dominate the automotive light source industry. Although it has a greater energy conversion efficiency, the thermal management of LED headlamps is still a problem. In this research, the response surface method is used to optimize the heatsink designs for LED automotive headlamp module. The finite element (FE) approach and numerical simulation are used to model the test sample's temperature distribution. Then, in order to maximize the heatsink potential for thermal dissipation, we tested different types of material, and used the response surface method. The LED headlamp hot spots decrease by 2 to 8 degrees when the heat sink's thickness, fin spacing, and height are optimized; and decrease by 7.64 degrees when the heat sink and PCB substrate are made of 6063 aluminum alloy and AlN, respectively.